Substrate Transport Device - Company Ranking(7 companies in total)
Last Updated： Aggregation Period:Aug 26, 2026〜Sep 22, 2026
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Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| The non-contact transport device "Float Chuck LNA-S type" holds and transports ceramic green sheets in a non-contact manner by blowing air a... | Can transport 120μm thick ceramic green sheets, through-hole substrates, non-woven fabrics, and optical films without damage. | ||
| Stacked printed circuit boards, through-hole boards, FPCs, films, and ceramic substrates are transported one by one without contact, regardl... | Transport each stacked through-hole ceramic printed circuit board individually by suction. Transport each board non-contact, regardless of h... | ||
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ソーラーリサーチ研究所 大阪事業所
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- Featured Products
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Through-hole substrate transport device "Float Chuck LNA-S type"
- overview
- The non-contact transport device "Float Chuck LNA-S type" holds and transports ceramic green sheets in a non-contact manner by blowing air a...
- Application/Performance example
- Can transport 120μm thick ceramic green sheets, through-hole substrates, non-woven fabrics, and optical films without damage.
Through-hole board and FPC board transfer device
- overview
- Stacked printed circuit boards, through-hole boards, FPCs, films, and ceramic substrates are transported one by one without contact, regardl...
- Application/Performance example
- Transport each stacked through-hole ceramic printed circuit board individually by suction. Transport each board non-contact, regardless of h...
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ソーラーリサーチ研究所 大阪事業所
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